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Kwethulwa Inqubo Yokukhiqiza Yezikrini Zombala ze-Industrial-Grade TFT

Ezindaweni ezidingeka kakhulu ezifana ne-industrial automation, okokusebenza kwezokwelapha, nezokuthutha ezihlakaniphile, ukuzinza nokuthembeka kwezikrini zokubonisa ze-TFT kuthinta ngokuqondile ukusebenza kukonke kwezisetshenziswa. Njengengxenye eyinhloko yokubonisa yamadivayisi ezimboni, izikrini zemibala ye-TFT yezinga lezimboni seziyinketho ekhethwayo ezindaweni eziningi ezinokhahlo ngenxa yokulungiswa kwazo okuphezulu, ukuguquguquka okubanzi kwezinga lokushisa, nokuphila isikhathi eside. Ngakho-ke, kukhiqizwa kanjani isikrini sombala sezinga eliphezulu se-TFT yezinga lezimboni? Yimaphi amasu ayisisekelo kanye nezinzuzo zobuchwepheshe ezilele ngemuva kwezikrini zemibala ye-TFT?

Inqubo yokukhiqiza yezikrini zemibala ye-TFT yezinga lezimboni ihlanganisa ukukhiqizwa okunembayo nokulawulwa kwekhwalithi okuqinile, lapho isinyathelo ngasinye sithinta ngokuqondile ukusebenza nokuthembeka kwesikrini se-TFT. Ngezansi ukugeleza komsebenzi wokukhiqiza okuyinhloko:

  1. Ukulungiswa kwe-Glass Substrate
    Ingilazi engena-alkali enobumsulwa obuphakeme isetshenziselwa ukuqinisekisa ukusebenza okuhle kakhulu kwe-optical nokuzinza okushisayo, ukubeka isisekelo sokwenziwa okulandelayo kongqimba lwesekethe ye-TFT.
  2. I-Thin-Film Transistor (TFT) Array Manufacturing
    Ngezinqubo ezinembayo ezifana ne-sputtering, i-photolithography, ne-etching, kwakheka i-matrix ye-TFT ku-substrate yengilazi. I-transistor ngayinye ihambisana nephikseli, okuvumela ukulawula okunembayo kwesibonisi se-TFT.
  3. Ukukhiqizwa Kwesihlungi Sombala
    Izendlalelo zesihlungi sombala we-RGB zimbozwe kwenye i-substrate yengilazi, kulandelwa ukusetshenziswa kwe-matrix emnyama (BM) ukuze kuthuthukiswe ukugqama nokuhlanzeka kombala, kuqinisekiswe izithombe ezigqamile nezifana nempilo.
  4. I-Liquid Crystal Injection kanye ne-Encasulation
    Ama-substrates amabili engilazi aqondaniswe ngokunembile futhi aboshelwa endaweni engenalo uthuli, futhi okokusebenza kwekristalu okuwuketshezi kujovwa ukuvimbela ukungcola ukuthi kuthinte ikhwalithi yokubonisa ye-TFT.
  5. Shayela i-IC ne-PCB Bonding
    I-chip yomshayeli nesekethe ephrintiwe eguqukayo (i-FPC) ixhunywe kuphaneli ukuze kunikwe amandla okokufaka kwesignali kagesi kanye nokulawula isithombe esinembile.
  6. Umhlangano Wemojula Nokuhlolwa
    Ngemva kokuhlanganisa izingxenye ezifana ne-backlight, i-casing, ne-interfaces, ukuhlolwa okuphelele kwenziwa ekukhanyeni, isikhathi sokuphendula, ama-engeli wokubuka, ukufana kombala, nokuningi ukuze kuqinisekiswe ukuthi isikrini ngasinye sombala we-TFT sihlangabezana nezindinganiso zezinga lezimboni.

Isikhathi sokuthumela: Jul-01-2025